Model extraction of a paddle in plastic surface-mount RF-IC packages
Plastic packaging is a cost-effective solution for housing RF and microwave integrated circuits in low cost communication devices. While enabling low cost packaging of integrated circuits, plastic packages including the circuit ground patch (paddle) inside the package can have a significant parasiti...
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| Language: | en_US |
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2012
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| Online Access: | http://hdl.handle.net/1957/33163 |