Characterization of cold sprayed copper and copper alloys and simulation of coating profile, deposition yield and defect formation in cold spray deposition
In the cold spray (CS) process, solid powder particles accelerated to several hundred meters a second impact the substrate and deform into splats that are stacked up to form dense coatings on the substrate. However, these deposited splats are not fully bonded to each other, making deposited material...
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| Online Access: | http://hdl.handle.net/2047/D20249270 |