Modeling of chemical mechanical polishing for shallow trench isolation
Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000. === Includes bibliographical references (p. 75-77). === by Terence Gan. === S.B.and M.Eng.
Main Author: | Gan, Terence (Terence Chihkiong), 1975- |
---|---|
Other Authors: | Duane S. Boning. |
Format: | Others |
Language: | English |
Published: |
Massachusetts Institute of Technology
2014
|
Subjects: | |
Online Access: | http://hdl.handle.net/1721.1/86469 |
Similar Items
-
Modeling of chemical mechanical polishing for shallow trench isolation
by: Lee, Brian, 1975-
Published: (2006) -
Modeling of chemical mechanical polishing for dielectric planarization
by: Ouma, Dennis Okumu
Published: (2005) -
Characterization and modeling of uniformity in chemical mechanical polishing
by: Oji, Charles (Charles Ojih), 1974-
Published: (2013) -
Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
by: Tang, Brian D. (Brian David), 1980-
Published: (2005) -
Analysis on Pad Performance for Chemical Mechanical Polishing/Planarization of Shallow Trench Isolation
by: Shih-Yao Wang, et al.
Published: (2018)