Micro-scale scratching by soft pad asperities in chemical-mechanical polishing

Micro-scale scratching by soft pad asperities in chemical-mechanical polishing

Thesis: Ph. D., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2013. === Cataloged from PDF version of thesis. === Includes bibliographical references. === In the manufacture of integrated circuits (IC) and micro-electromechanical systems (MEMS), chemical-mechanical pol...

Full description

Bibliographic Details
Main Author: Kim, Sanha, Ph. D. Massachusetts Institute of Technology
Other Authors: Jung-Hoon Chun and Nannaji Saka.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2014
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/85537

Internet

http://hdl.handle.net/1721.1/85537

Similar Items