Modeling of and experiments characterizing electromigration-induced failures in interconnects

Modeling of and experiments characterizing electromigration-induced failures in interconnects

Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2001. === Includes bibliographical references (leaves 326-333). === As interconnect linewidths continue to scale downward, a detailed knowledge of stress evolution and void growth processes enables a d...

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Bibliographic Details
Main Author: Andleigh, Vaibhav K. (Vaibhav Kumar), 1973-
Other Authors: Carl V. Thompson.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2005
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/8429

Internet

http://hdl.handle.net/1721.1/8429

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