A study of through-silicon-via (TSV) induced transistor variation
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011. === Cataloged from PDF version of thesis. === Includes bibliographical references (p. 83-85). === As continued scaling becomes increasingly difficult, 3D integration has emerged as a via...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2011
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| Online Access: | http://hdl.handle.net/1721.1/66483 |