Effects of surface properties on solder bump formation by direct droplet deposition
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004. === Includes bibliographical references (leaves 158-162). === Recent advances in microdroplet generation and deposition processes have made it possible to directly form solder bumps on integrated circuits...
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| Format: | Others |
| Language: | en_US |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/27100 |