Dielectric spin coating characterization, modeling, and planarization using fill patterns for advanced packaging technologies
Thesis: M. Eng., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2017. === This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. === Cataloged from student-s...
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| Format: | Others |
| Language: | English |
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Massachusetts Institute of Technology
2018
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| Online Access: | http://hdl.handle.net/1721.1/113137 |