Crack detection in silicon wafers using shearography.
Defects in silicon wafers affect their mechanical stability considerably during their processing and handling. In the new generation of thin silicon wafers, in addition to subsurface defects, cracks are also one of the most important defects that need to be evaluated. A comprehensive review of liter...
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2008
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| Online Access: | http://spectrum.library.concordia.ca/976221/1/MR45495.pdf Motamedi, Ramak <http://spectrum.library.concordia.ca/view/creators/Motamedi=3ARamak=3A=3A.html> (2008) Crack detection in silicon wafers using shearography. Masters thesis, Concordia University. |