Numerical Investigation of the Cooling Performance of Microchannel Heat Sinks under Uniform and Non-Uniform Heating Conditions

High-power electronic devices are now widely applied in computer, mechanical and sustainable energy industries. As electronic devices become further more integrated and powerful, more effective cooling is required to remove increasing heat fluxes generated by smaller devices. Microchannel heat sink...

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Bibliographic Details
Main Author: Ling, Ling
Format: Others
Published: 2012
Online Access:http://spectrum.library.concordia.ca/975059/1/Ling_MASc_S2013.pdf
Ling, Ling <http://spectrum.library.concordia.ca/view/creators/Ling=3ALing=3A=3A.html> (2012) Numerical Investigation of the Cooling Performance of Microchannel Heat Sinks under Uniform and Non-Uniform Heating Conditions. Masters thesis, Concordia University.