Process Kinetics of Transient Liquid Phase

The problem of inadequate measurement techniques for quantifying the isothermal solidification process during transient liquid phase sintering (TLPS) in binary isomorphous systems such as Ni-Cu, and the resulting uncertainty regarding the solidification mechanism and its sensitivity to important pro...

Full description

Bibliographic Details
Main Author: Turriff, Dennis Michael Ryan
Language:en
Published: 2007
Subjects:
TLP
Ni
Cu
VMP
Online Access:http://hdl.handle.net/10012/3287