The influence of additives on microstructure evolution of electrochemically deposited copper films
This thesis presents an investigation of the effects of additives on kinetics of deposition and microstructure evolution of Cu films, which were electrochemically deposited (ECD) on Au substrates. The rate of bulk Cu deposition was quantified with cyclic voltammetry. The self-annealing of the as-...
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| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/2429/15192 |