Electrodeposition of Pb-free, Sn-based Alloy Solder Films
The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag...
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| Format: | Others |
| Language: | en_US |
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2009
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| Online Access: | http://hdl.handle.net/10048/396 |