Analysis Of Squeeze Film Damping In Microdevices

Analysis Of Squeeze Film Damping In Microdevices

There are various energy dissipation mechanisms that affect the dynamic response of microstructures used in MEMS devices. A cumulative effect of such losses is captured by an important characteristic of the structure called Quality factor or Q-factor. Estimating Q-factor at the design stage is cruci...

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Bibliographic Details
Main Author: Pandey, Ashok Kumar
Other Authors: Pratap, Rudra
Language:en_US
Published: 2012
Subjects:
MEMS Device
Micro Device
Micro Electromechanical System Device
Squeeze Film Damping
Microdevices
Microelectromechanical System Devices
Q-factor
Mechanical Engineering
Online Access:http://etd.iisc.ernet.in/handle/2005/1867
http://etd.ncsi.iisc.ernet.in/abstracts/2406/G17927-Abs.pdf

Internet

http://etd.iisc.ernet.in/handle/2005/1867
http://etd.ncsi.iisc.ernet.in/abstracts/2406/G17927-Abs.pdf

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