Facile and Process Compatible Growth of High-k Gate Dielectric Materials (TiO2, ZrO2 and HfO2) on Si and the Investigation of these Oxides and their Interfaces by Deep Level Transient Spectroscopy
The continuous downscaling has enforced the device size and oxide thickness to few nanometers. After serving for several decades as an excellent gate oxide layer in complementary metal oxide semiconductor (CMOS) devices, the thickness of SiO2 layer has reached to its theoretical limits. Ultra-thin f...
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Language: | en_US |
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2018
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Online Access: | http://etd.iisc.ernet.in/2005/3820 http://etd.iisc.ernet.in/abstracts/4691/G28261-Abs.pdf |