Whisker Growth from Electrodeposited Sn Coatings - Developing Materials Science and Mechanics Based Insights

Whisker Growth from Electrodeposited Sn Coatings - Developing Materials Science and Mechanics Based Insights

Pure Sn and Sn-alloys are widely used in electrical and microelectronic devices as protective layer to prevent oxidation of Cu conductors and also as a component of Pb-free, Sn-based solders. Sn coatings, typically 0.5-10 μm thick, deposited on substrates, e.g., Cu, brass, etc., are prone to spontan...

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Bibliographic Details
Main Author: Jagtap, Piyush
Other Authors: Praveen Kumar, *
Language:en_US
Published: 2018
Subjects:
Electrodeposited Sn Coating
Mechanics Based Insights
Whisker Density Evaluation
Whiskering Grain
Multi-beam Optical Stress Sensor (MOSS)
Whisker Growth
Whisker Grain
Whiskers
Sn Coatings
Whisker Mitigation Technique
Materials Engineering
Online Access:http://etd.iisc.ernet.in/2005/3592
http://etd.iisc.ernet.in/abstracts/4461/G28202-Abs.pdf

Internet

http://etd.iisc.ernet.in/2005/3592
http://etd.iisc.ernet.in/abstracts/4461/G28202-Abs.pdf

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