Investigation of Electro-thermal and Thermoelectric Properties of Carbon Nanomaterials

Due to the aggressive downscaling of the CMOS technology, power and current densities are increasing inside the chip. The limiting current conduction capacity(106 Acm−2)and thermal conductivity(201Wm−1K−1 for Al and 400 Wm−1K−1 for Cu) of the existing interconnects materials has given rise to differ...

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Bibliographic Details
Main Author: Verma, Rekha
Other Authors: Mahapatra, Santanu
Language:en_US
Published: 2018
Subjects:
Online Access:http://etd.iisc.ernet.in/2005/3360
http://etd.iisc.ernet.in/abstracts/4228/G25761-Abs.pdf