Investigation of Electro-thermal and Thermoelectric Properties of Carbon Nanomaterials
Due to the aggressive downscaling of the CMOS technology, power and current densities are increasing inside the chip. The limiting current conduction capacity(106 Acm−2)and thermal conductivity(201Wm−1K−1 for Al and 400 Wm−1K−1 for Cu) of the existing interconnects materials has given rise to differ...
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Language: | en_US |
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2018
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Online Access: | http://etd.iisc.ernet.in/2005/3360 http://etd.iisc.ernet.in/abstracts/4228/G25761-Abs.pdf |