Measurement and modeling of fluid pressures in chemical mechanical polishing

Measurement and modeling of fluid pressures in chemical mechanical polishing

A theory of the sub-ambient fluid pressure phenomenon observed during the wet sliding of a disk on a polymeric pad is presented. Two-dimensional fluid pressure mapping using membrane pressure sensors reveals a large, asymmetrical sub-ambient pressure region occupying about 70 percent of the disk-pad...

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Bibliographic Details
Main Author: Ng, Sum Huan
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2005
Subjects:
Contact
Polishing
Semiconductors
Pressure
Material removal
Lubrication and lubricants
Fluid dynamics
Grinding and polishing
Integrated circuits Design and construction
Online Access:http://hdl.handle.net/1853/6857

Internet

http://hdl.handle.net/1853/6857

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