Design and testing of an orthogonal LCP interconnect for RF applications in high vibration environments
A new design is presented for a wideband orthogonal interconnect between two perpendicular printed wiring boards, employing novel geometries and materials to minimize stress under cyclic loading. This will ensure fatigue survivability in high vibration environments, opening the door to vertical inte...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2016
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| Online Access: | http://hdl.handle.net/1853/54950 |