Transient simulation for multiscale chip-package structures using the Laguerre-FDTD scheme
The high-density integrated circuit (IC) gives rise to geometrically complex multiscale chip-package structures whose electromagnetic performance is difficult to predict. This motivates this dissertation to work on an efficient full-wave transient solver that is capable of capturing all the electrom...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2015
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| Online Access: | http://hdl.handle.net/1853/53856 |