Energy efficient active cooling of integrated circuits using embedded thermoelectric devices
With technology scaling, the amount of transistors on a single chip doubles itself every 18 months giving rise to increased power density levels. This has directly lead to a rapid increase of thermal induced issues on a chip and effective methodologies of removing the heat from the system has become...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2015
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| Online Access: | http://hdl.handle.net/1853/53047 |