Modeling, design, fabrication and characterization of glass package-to-PCB interconnections

Modeling, design, fabrication and characterization of glass package-to-PCB interconnections

Emerging I/O density and bandwidth requirements are driving packages to low-CTE silicon, glass and organic substrates for higher wiring density and reliability of interconnections and Cu-low k dielectrics. These are needed for high performance applications as 2.5D packages in large-size, and also as...

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Bibliographic Details
Main Author: Menezes, Gary
Other Authors: Tummala, Rao R.
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2014
Subjects:
Glass package
BGA
Large package
Electronic packaging
Computer input-output equipment
Interconnects (Integrated circuit technology)
Online Access:http://hdl.handle.net/1853/51781

Internet

http://hdl.handle.net/1853/51781

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