Development of lightweight and low-cost microwave components for remote-sensing applications

Development of lightweight and low-cost microwave components for remote-sensing applications

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The objective of the proposed research is to design, implement, and characterize low-cost, lightweight front-end components and subsystems in the microwave domain through innovative packaging architectures for remote sensing applications. Particular emphasis is placed on system-on-package (SoP) solu...

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Bibliographic Details
Main Author: Donado Morcillo, Carlos Alberto
Other Authors: Papapolymerou, John
Language:en_US
Published: Georgia Institute of Technology 2014
Subjects:
Radio frequency (RF)
SiGe
Cold land process
TaN
Microstrip model
Microstrip patch antenna
Flat-panel antenna
Thermal modeling
Thermal characterization of dielectric
Flip-chip bond
AlN
Microwave filter
Remote sensing
Integrated circuits
Microelectromechanical systems
Online Access:http://hdl.handle.net/1853/51733

Internet

http://hdl.handle.net/1853/51733

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