Thermal management of 3-D stacked chips using thermoelectric and microfluidic devices

Thermal management of 3-D stacked chips using thermoelectric and microfluidic devices

This thesis employs computational and experimental methods to explore hotspot cooling and high heat flux removal from a 3-D stacked chip using thermoelectric and microfluidic devices. Stacked chips are expected to improve microelectronics performance, but present severe thermal management challenges...

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Bibliographic Details
Main Author: Redmond, Matthew J.
Other Authors: Kumar, Satish
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2014
Subjects:
Microelectronics cooling
Thermoelectric coolers
Microchannels
3DICs
Stacked chips
Microelectronics
Three-dimensional integrated circuits
Heat Transmission
Online Access:http://hdl.handle.net/1853/50240

Internet

http://hdl.handle.net/1853/50240

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