Design exchange formats for assessing ohmic drops and thermal profiles in three dimensional integrated circuits
dimensional integrated circuits (3D ICs) fabricated with through-silicon vias (TSVs) have smaller planar dimensions, shorter wire length, and better performance than 2D ICs. Heat dissipation causing temperature increase has posed new challenges for design of 3D integrated circuits (IC). In addition...
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Georgia Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1853/47615 |