Fundamental investigations of cutting of silicon for photovoltaic applications
Crystalline silicon (Si) wafers used as substrates in the semiconductor and photovoltaic (PV) industries are traditionally manufactured using a multi-wire slurry sawing (MWSS) technique. Due to its high productivity potential, the fixed abrasive diamond wire sawing (DWS) technique is of considerable...
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Georgia Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1853/45855 |