Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts
The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-induced carrier mobility variation, temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use th...
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Georgia Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1853/45783 |