Design and fabrication of lanthanum-doped Sn-Ag-Cu lead-free solder for next generation microelectronics applications in severe environment

Design and fabrication of lanthanum-doped Sn-Ag-Cu lead-free solder for next generation microelectronics applications in severe environment

Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coars...

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Bibliographic Details
Main Author: Sadiq, Muhammad
Published: Georgia Institute of Technology 2012
Subjects:
Microelectronics
InterMetallic compounds (IMCs)
Microstructure evolution
Thermal coarsening (Aging)
Creep behaviour
Characterization
Electronic packaging
Wettability
Nanoindentation
Nanotechnology
Rare-earth elements (Lanthanum)
Lead-free solder
Lanthanum
Lead-free electronics manufacturing processes
Solder and soldering
Microstructure
Online Access:http://hdl.handle.net/1853/44762

Internet

http://hdl.handle.net/1853/44762

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