Fast methods for full-wave electromagnetic simulations of integrated circuit package modules

Fast methods for full-wave electromagnetic simulations of integrated circuit package modules

Fast methods for the electromagnetic simulation of integrated circuit (IC) package modules through model order reduction are demonstrated. The 3D integration of multiple functional IC chip/package modules on a single platform gives rise to geometrically complex structures with strong electromagnetic...

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Bibliographic Details
Main Author: Terizhandur Varadharajan, Narayanan
Published: Georgia Institute of Technology 2011
Subjects:
Electromagnetic simulation
Model order reduction
Microelectronic packaging
Electromagnetic interference
Integrated circuits Computer simulation
Online Access:http://hdl.handle.net/1853/41059

Internet

http://hdl.handle.net/1853/41059

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