Molecular dynamics simulation of the carbon nanotube - substrate thermal interface resistance
Thermal management is a key challenge to improving the performance of microelectronic devices. For many high performance applications, the thermal resistance between chip and heat sink may account for half of the total thermal budget. Chip-level heat dissipation is therefore a critical bottleneck...
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Georgia Institute of Technology
2010
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| Online Access: | http://hdl.handle.net/1853/31765 |