Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates

Thermo-mechanical reliability of ultra-thin low-loss system-on-package substrates

Miniaturization and functionality have always governed advances in electronic system technology. To truly achieve the goal of a multi mega-functional system, advances must be made not just at the IC level, but at the system level too. This concept of tighter integration at the system level is called...

Full description

Bibliographic Details
Main Author: Krishnan, Ganesh
Published: Georgia Institute of Technology 2009
Subjects:
Mobile applications
Substrate
Microvia
Warpage
Thin substrate
Reliability
Microelectronic packaging
Mobile computing
Miniature electronic equipment
Online Access:http://hdl.handle.net/1853/26474

Internet

http://hdl.handle.net/1853/26474

Similar Items