Enhanced Adhesion Between Electroless Copper and Advanced Substrates
In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller...
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Georgia Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1853/22615 |