Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach
Ever growing demands for portability and functionality have always governed the electronic technology innovations. IC downscaling with Moore s law and system miniaturization with System-On-Package (SOP) paradigm has resulted and will continue to result in ultraminiaturized systems with unprecedented...
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Georgia Institute of Technology
2008
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| Online Access: | http://hdl.handle.net/1853/22594 |