Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)

Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)

Bibliographic Details
Main Author: Li, Weiping
Published: Georgia Institute of Technology 2008
Subjects:
Integrated circuits
Microelectronics
Electronic circuits
Printed circuits Design and construction
Online Access:http://hdl.handle.net/1853/19641
id ndltd-GATECH-oai-smartech.gatech.edu-1853-19641
record_format oai_dc
spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-196412013-12-15T03:37:38ZLarge-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)Li, WeipingIntegrated circuitsMicroelectronicsElectronic circuitsPrinted circuits Design and constructionGeorgia Institute of Technology2008-02-07T12:30:59Z2008-02-07T12:30:59Z1999-05Dissertationhttp://hdl.handle.net/1853/19641493963Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Integrated circuits
Microelectronics
Electronic circuits
Printed circuits Design and construction
spellingShingle Integrated circuits
Microelectronics
Electronic circuits
Printed circuits Design and construction
Li, Weiping
Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
author Li, Weiping
author_facet Li, Weiping
author_sort Li, Weiping
title Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
title_short Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
title_full Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
title_fullStr Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
title_full_unstemmed Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)
title_sort large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (pwb)
publisher Georgia Institute of Technology
publishDate 2008
url http://hdl.handle.net/1853/19641
work_keys_str_mv AT liweiping largearealowcostviaformationandmetallizationinmultilayerthinfilminterconnectiononprintedwiringboardspwb
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