Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)

Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)

Bibliographic Details
Main Author: Li, Weiping
Published: Georgia Institute of Technology 2008
Subjects:
Integrated circuits
Microelectronics
Electronic circuits
Printed circuits Design and construction
Online Access:http://hdl.handle.net/1853/19641

Internet

http://hdl.handle.net/1853/19641

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