Study on metal adhesion mechanisms in high density interconnect printed circuit boards

Study on metal adhesion mechanisms in high density interconnect printed circuit boards

Bibliographic Details
Main Author: Martin, Lara J.
Published: Georgia Institute of Technology 2008
Subjects:
Microelectronic packaging Materials
Adhesion
Metals Testing
Printed circuits Materials
Online Access:http://hdl.handle.net/1853/19628

Internet

http://hdl.handle.net/1853/19628

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