Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Bibliographic Details
Main Author: Baynham, Grant Andrew
Published: Georgia Institute of Technology 2008
Subjects:
Microelectronic packaging Materials
Solder and soldering
Green technology
Online Access:http://hdl.handle.net/1853/19313

Internet

http://hdl.handle.net/1853/19313

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