Advanced encapsulation processing for low cost electronics assembly

Advanced encapsulation processing for low cost electronics assembly

Bibliographic Details
Main Author: Pascarella, Nathan William
Published: Georgia Institute of Technology 2008
Subjects:
Electronic packaging
Multichip modules (Microelectronics)
Surface mounting (Electronics)
Online Access:http://hdl.handle.net/1853/19031

Internet

http://hdl.handle.net/1853/19031

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