Physics-based modeling methodology for reliability of microvias

Physics-based modeling methodology for reliability of microvias

Bibliographic Details
Main Author: Ramakrishna, Gnyaneshwar
Published: Georgia Institute of Technology 2007
Subjects:
Integrated circuits Design and construction
Microelectronic packaging Materials
Online Access:http://hdl.handle.net/1853/18843

Internet

http://hdl.handle.net/1853/18843

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