High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging

High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging

Bibliographic Details
Main Author: Ok, Seong Joon
Published: Georgia Institute of Technology 2007
Subjects:
Microelectromechanical systems
Microelectronic packaging
Online Access:http://hdl.handle.net/1853/18227

Internet

http://hdl.handle.net/1853/18227

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