Thermo-mechanical behavior and reliability of High Density Interconnect (HDI) vias

Thermo-mechanical behavior and reliability of High Density Interconnect (HDI) vias

Bibliographic Details
Main Author: Smith, Kyle Edward
Published: Georgia Institute of Technology 2007
Subjects:
Electronic packaging Reliability
Online Access:http://hdl.handle.net/1853/17981

Internet

http://hdl.handle.net/1853/17981

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