Study of warpage of base substrates and materials for large-area MCM-D packaging

Study of warpage of base substrates and materials for large-area MCM-D packaging

Bibliographic Details
Main Author: Dang, Anh Xuan-Hung
Published: Georgia Institute of Technology 2007
Subjects:
Multichip modules (Microelectronics)
Microelectronic packaging Materials
Online Access:http://hdl.handle.net/1853/17804

Internet

http://hdl.handle.net/1853/17804

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