A semi-quantitative method for thin film adhesion measurement

A semi-quantitative method for thin film adhesion measurement

Bibliographic Details
Main Author: Ting, Bond-Yen
Published: Georgia Institute of Technology 2007
Subjects:
Thin films
Adhesion
Online Access:http://hdl.handle.net/1853/17643

Internet

http://hdl.handle.net/1853/17643

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