Prediction of thermally induced printed wiring board warpage

Prediction of thermally induced printed wiring board warpage

Bibliographic Details
Main Author: Garratt, Jeffery David
Published: Georgia Institute of Technology 2007
Subjects:
Printed circuits Design and construction
Surface mount technology
Online Access:http://hdl.handle.net/1853/17052

Internet

http://hdl.handle.net/1853/17052

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