The effect of moisture on the interfacial fracture toughness of packaging interfaces

The effect of moisture on the interfacial fracture toughness of packaging interfaces

Bibliographic Details
Main Author: Ferguson, Timothy Patrick
Published: Georgia Institute of Technology 2007
Subjects:
Microelectronic packaging Reliability
Fracture mechanics
Moisture
Online Access:http://hdl.handle.net/1853/16613
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spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-166132013-12-15T03:35:21ZThe effect of moisture on the interfacial fracture toughness of packaging interfacesFerguson, Timothy PatrickMicroelectronic packaging ReliabilityFracture mechanicsMoistureGeorgia Institute of Technology2007-09-26T14:23:57Z2007-09-26T14:23:57Z2000-12Thesishttp://hdl.handle.net/1853/16613590582Access restricted to authorized Georgia Tech users only.
collection NDLTD
sources NDLTD
topic Microelectronic packaging Reliability
Fracture mechanics
Moisture
spellingShingle Microelectronic packaging Reliability
Fracture mechanics
Moisture
Ferguson, Timothy Patrick
The effect of moisture on the interfacial fracture toughness of packaging interfaces
author Ferguson, Timothy Patrick
author_facet Ferguson, Timothy Patrick
author_sort Ferguson, Timothy Patrick
title The effect of moisture on the interfacial fracture toughness of packaging interfaces
title_short The effect of moisture on the interfacial fracture toughness of packaging interfaces
title_full The effect of moisture on the interfacial fracture toughness of packaging interfaces
title_fullStr The effect of moisture on the interfacial fracture toughness of packaging interfaces
title_full_unstemmed The effect of moisture on the interfacial fracture toughness of packaging interfaces
title_sort effect of moisture on the interfacial fracture toughness of packaging interfaces
publisher Georgia Institute of Technology
publishDate 2007
url http://hdl.handle.net/1853/16613
work_keys_str_mv AT fergusontimothypatrick theeffectofmoistureontheinterfacialfracturetoughnessofpackaginginterfaces
AT fergusontimothypatrick effectofmoistureontheinterfacialfracturetoughnessofpackaginginterfaces
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