The effect of moisture on the interfacial fracture toughness of packaging interfaces

The effect of moisture on the interfacial fracture toughness of packaging interfaces

Bibliographic Details
Main Author: Ferguson, Timothy Patrick
Published: Georgia Institute of Technology 2007
Subjects:
Microelectronic packaging Reliability
Fracture mechanics
Moisture
Online Access:http://hdl.handle.net/1853/16613

Internet

http://hdl.handle.net/1853/16613

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