Fracture in stress engineered, high density, thin film interconnects

Bibliographic Details
Main Author:	Modi, Mitul B.
Published:	Georgia Institute of Technology 2007
Subjects:	Thin films Fracture
Online Access:	http://hdl.handle.net/1853/16336

id	ndltd-GATECH-oai-smartech.gatech.edu-1853-16336
record_format	oai_dc
spelling	ndltd-GATECH-oai-smartech.gatech.edu-1853-163362013-12-15T03:35:06ZFracture in stress engineered, high density, thin film interconnectsModi, Mitul B.Thin films FractureGeorgia Institute of Technology2007-08-17T11:30:30Z2007-08-17T11:30:30Z2003-05Dissertationhttp://hdl.handle.net/1853/16336670067Access restricted to authorized Georgia Tech users only.
collection	NDLTD
sources	NDLTD
topic	Thin films Fracture
spellingShingle	Thin films Fracture Modi, Mitul B. Fracture in stress engineered, high density, thin film interconnects
author	Modi, Mitul B.
author_facet	Modi, Mitul B.
author_sort	Modi, Mitul B.
title	Fracture in stress engineered, high density, thin film interconnects
title_short	Fracture in stress engineered, high density, thin film interconnects
title_full	Fracture in stress engineered, high density, thin film interconnects
title_fullStr	Fracture in stress engineered, high density, thin film interconnects
title_full_unstemmed	Fracture in stress engineered, high density, thin film interconnects
title_sort	fracture in stress engineered, high density, thin film interconnects
publisher	Georgia Institute of Technology
publishDate	2007
url	http://hdl.handle.net/1853/16336
work_keys_str_mv	AT modimitulb fractureinstressengineeredhighdensitythinfilminterconnects
_version_	1716618027432148992

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