Fracture in stress engineered, high density, thin film interconnects

Fracture in stress engineered, high density, thin film interconnects

Bibliographic Details
Main Author: Modi, Mitul B.
Published: Georgia Institute of Technology 2007
Subjects:
Thin films Fracture
Online Access:http://hdl.handle.net/1853/16336

Internet

http://hdl.handle.net/1853/16336

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