Processing of no-flow fluxing uderfills for flip chip assembly

Processing of no-flow fluxing uderfills for flip chip assembly

Bibliographic Details
Main Author:	Lazarakis, Theodoros L.
Published:	Georgia Institute of Technology 2007
Subjects:	Flip chip technology Design and construction Electronic apparatus and appliances Packaging Integrated circuits Design and construction
Online Access:	http://hdl.handle.net/1853/16039

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