Processing of no-flow fluxing uderfills for flip chip assembly

Processing of no-flow fluxing uderfills for flip chip assembly

Bibliographic Details
Main Author: Lazarakis, Theodoros L.
Published: Georgia Institute of Technology 2007
Subjects:
Flip chip technology Design and construction
Electronic apparatus and appliances Packaging
Integrated circuits Design and construction
Online Access:http://hdl.handle.net/1853/16039

Internet

http://hdl.handle.net/1853/16039

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